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Sic Process Engineering - Wafer Surface Grinding M/F

Sic Process Engineering - Wafer Surface Grinding M/F
Azienda:

St Microelectronics



Funzione Lavorativa:

Ingegneria

Dettagli della offerta

SiC Process Engineering - Wafer Surface Grinding M/F Posting titleSiC Process Engineering - Wafer Surface Grinding M/F
Regular/TemporaryRegular
You will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania for the manufacturing of SiC substrate wafers, this facility will be a first of a kind in Europe for the production in volume of SiC epitaxial substrates, integrating all steps in the production flow.
Strong link is maintained with STMicroelectronics Silicon Carbide AB, located in Norrköping, Sweden, with opportunities for on-site training and collaboration. STMicroelectronics Silicon Carbide AB, previously named Norstel AB, is the ST competence center in SiC material technology: the company has been developing silicon carbide for 20 years, first at Linköping University, and since 2006 in a dedicated production facility in Norrköping.
Your role will be part of the Wafer Finishing group inside the Process Engineering team.
The focus of the group will be to ensure a smooth transition between the R&D activities and the mass-production fab and to maintain high product quality, defining process flows and recipes, ensuring equipment performances, understanding and exploiting the interactions between different process steps.
KEY RESPONSIBILITIES
Lead the process steps transfer from the R&D fab to the High-Volume Manufacturing fab with focus on Wafer Surface Grinding processHands-on work with processes and tools used in SiC semiconductor technologyConduct systematic troubleshooting of equipment-related problemsImplement and refine procedures and qualification plans for bringing new processes on lineQualify new production tools with suppliers and against internal criteriaTrain new employees (operators, technicians and engineers)Ensure process robustness and stability by managing equipment control charts, tool alarms, fault detectionSupport R&D projectsContribute to yield enhancement and process industrializationProfileBoth junior and senior profiles will be evaluated, with the following background and characteristics:
PhD or Master in scientific faculty, e.g. in Mechanical Engineering, Material Science, Physics, ChemistryExperience in silicon processing and flow knowledge is a plusPrecision, attention to details and good manual skillsFluent English is a mustGood communication skills and able to work in a teamCommitted, Proactive and CuriousJob location2-5 years
LanguagesRequester26/01/2024
General informationReference2024-37578 Reference2024-37578
Job level40 - Experienced
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Risorsa: Jobleads

Funzione Lavorativa:

Requisiti

Sic Process Engineering - Wafer Surface Grinding M/F
Azienda:

St Microelectronics



Funzione Lavorativa:

Ingegneria

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